Introduction

High-speed digital circuit design is on the rise in recent times. With the frequency of the clock used in PCB increasing and the data rates of the communication protocols increasing, PCB has become a structure built to deliver supreme performance. Taking such high performance metrics into consideration, it is important for a designer to plan high-speed interconnects and select board material with desired characteristics.

The success of signal-integrity in a depends on handling bottlenecks such as reflection, crosstalk, delay, and impedance matching – which are routinely done by us here at
These problems are the result of increasing data rates at the Input/output and memory interfaces, and due to the high-speed transceiver technologies that are embedded into FPGAs and PCBs. This article discusses various reasons that affect the signal integrity in a PCB design and the good design practices used to overcome these shortcomings.